nVent offers solutions for lab and field use based on a modular COM
(Computer On Module) carrier for type 6 COM express modules.
The embedded system solutions includes:
- COM module
- COM carrier
- Integrated cases with cooling and power management
COM Express modules, standardized by PICMG, support the latest signals
such as HDMI, Gigabit Ethernet, USB 2.0 & 3.0 and PCI Express.
Looking for guidance on how to choose the right COM solution?
selecting a COM Express system
Integrated cases with cooling and power management
|Specific heat sink geometries for different applications|
|Thermal connection from COM heat spreader to heat sink
with EMC gaskets on thermal adapter
|Easy removal of front and rear panel|
Schroff Carrier for COM Express Type 6 Modules
Front side: Standard computing interfaces
Back side: Additional computing interfaces
What is a COM Carrier?
A COM carrier is a carrier board to which a COM module is plugged. The use of COM modules reduce development costs and saves time. All I/O interfaces are provided on the Schroff carrier board. For new product development, this means standardized COM modules from different manufacturers can be used along with either the standard or a customized COM carrier from nVent.
The Schroff COM Carrier provides common computer interfaces and features slots for various expansion boards. Expansion boards are inserted parallel to the carrier and include additional features such as a MiniPCI Express interfaces for connecting graphics cards, hard drives or wireless modules. Other expansion boards include a postcode module for debugging hardware and software, a prototype module for integrating additional functions using the GPIOs of the COM module or fieldbus modules for connecting to industry fieldbuses. Additionally, nVent provides an interface for a PMC or an XMC module using these kinds of expansion boards.
Computer on Module
The new standard COM carrier from nVent uses the µATX form factor with an edge length of 244 mm x 244 mm. The modular design of the carrier is notable as it provides common computer interfaces and features slots for various expansion boards that can add additional functions as required.
Modular COM system concept:
- Interfaces can be adjusted based on requirements
- Slots for various expansion boards
- Efficient, low-interference power supply
- Choice of integration level
- Enclosure with IP protection up to IP 55 (optionally up to IP 67)
- Flexible cooling design for forced air cooling or passive cooling applications
- The height, width and depth of the small case can be adjusted