FOR YOUR CASE.
Depending on the amount of thermal energy created, various options are offered to cool embedded systems. In some systems, power loss is so low that no cooling is necessary. If power loss increases, convection cooled Interscale cases can be equipped with perforations and optional fan kits.
The heat can also be dissipated by conduction cooling using an integrated heat conductor or Schroff’s patented flexible heat conductor (FHC). Conduction cooling works by creating a direct thermal path from the processor through a heat conductor to the surrounding area.