PCB Wedge Loks / Card Loks
nVent has a broad backplane portfolio in accordance to several PICMG and VITA specification. The excellent signal integrity allows highest data transfer rates.
New: nVent introduces its first 100 Gbps Schroff AdvancedTCA backplane, verified according to the design requirements of the PICMG3.1R3.0 specifications for 100 Gbps Ethernet.
What is a backplane?
The backplane is the electrical interface in a modular system. The boards inside the system plug into the backplane which contains the data bus. In legacy technologies like VMEbus or CompactPCI this was a parallel bus structure with 32- or 64-bit bus width. Newer technologies like CompactPCI Serial or VPX use a LVDS (low voltage differential signaling) point to point connections. The backplane also provides the power for a connected power supply to the boards. Two organizations, PICMG and VITA, define open standards where the mechanics, the connectors between board and backplane, the pinout of those connectors and different connection schemes (topologies) are defined. In addition the transfer protocols are defined in those specifications. Typical data transfer rates of today are Ethernet with 10 Gbps per port or PCIe with 8 Gbps. As there are usually 4 respective 8 ports routed to each slots the transfer rate per boards aggregates to, for Ethernet, 40 Gbps or for PCIe up to 64 Gbps. 100G Ethernet with a speed of 25 Gbps per port is already on the horizon.
- Excellent signal integrity for the highest specified data transfer rates
- The broad backplane families let you find the fitting configuration for your application
- SMD components, ceramics capacitors and press fit connectors for highest reliability
- Minimum voltage drops inside the backplane
- Backplane routing optimized to achieve minimum layer count
- Comprehensive user manuals in download section