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- Flexible Heat Conductor (FHC), 20 mm (for Interscale conduction cooled)
Flexible Heat Conductor (FHC), 20 mm (for Interscale conduction cooled)

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- Designed for Intel, AMD, Via, Freescale, NVidia and TexasInstrument processors that employ a BGA socket
- Provides industry leading conduction cooling performance,10 % improvement over current conduction cooling methods
- Patent pending conduction cooling solution for small form factorelectronics
- Secured to PCB with thermally conductive adhesive tape
- Conductor block expands/contracts vertically to compensate fortolerance stack up and optimizes surface contact and pressurealong the thermal path; eliminates the need for a thermal gappad
- Compatible with Interscale C enclosures
Delivery Includes:
assembledIndividual Component Type:
Cooling
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Documents
Technical Data
Depth mm | 22.0 |
Width mm | 22.0 |
Height | 19.75 ± 1.5 mm |
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