PCB Tainers / Guides



Interscale Case

Depending on the amount of thermal energy created, various options are offered to cool embedded systems. In some systems, power loss is so low that no cooling is necessary. If power loss increases, convection cooled Interscale cases can be equipped with perforations and optional fan kits.

The heat can also be dissipated by conduction cooling using an integrated heat conductor or Schroff’s patented flexible heat conductor (FHC). Conduction cooling works by creating a direct thermal path from the processor through a heat conductor to the surrounding area.

Product List
Products (  1 - 12 of 28  )
Switch to grid view
Switch to list view
Next Page
Compare Selected compare product
Product Listing
Catalog Number: 125/126
Catalog Number: 165/166
Catalog Number: NW125/NW126
Catalog Number: NW165/NW166
Catalog Number: 115-287
Catalog Number: 120
Catalog Number: C120
Catalog Number: 24
Catalog Number: 25
Catalog Number: 127
Catalog Number: 28
Catalog Number: 29
Switch to grid view
Switch to list view
Next Page