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February 12, 2018

nVent Annouces Schroff Interscale Case Platform for Industrial IoT Applications:
A Comprehensive, Configurable Solution for Embedded Systems

nVent announced today a new concept for building embedded systems that offers design flexibility and affordable customization for industrial IoT applications. By using standardized modules, customers can build custom IIoT solutions and other applications while keeping costs at a minimum.

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October 30, 2017

nVent Announces AS9100 Certification Renewal
for its San Diego Manufacturing Facility of Schroff Retainers

nVent announces that its San Diego manufacturing facility has been awarded AS9100 Revision D renewal.
This certification continues to provide customers with the confidence they are receiving a high-quality products produced within a quality management system that meets stringent aviation, space and defense requirements.

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October 16, 2017

Easily configure front panels and generate 3D drawings

The newest 3D configurator from nVent's Schroff brand is now available.
The state-of-the-art user interface retains the same look and feel as the Novastar cabinet configurator that was released at the end of 2016, and offers new features including drag and drop functionality to easily configure front panels and generate 3D drawings. In addition, 3D CAD drawings, bills of material, and graphics are generated in real time, making the configurator a valuable tool for design engineers.

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September 5, 2017

Update: Higher efficiency and larger temperature range

nVent is updating and streamlining its Schroff power supply portfolio.
Various series of AC power supply products are being combined into the MaxpowerPro product family. The first devices in the new Maxpower supply unit series feature 180 W of output and are currently available. The power supply units from the former SEK series have been redesigned and are now available under the name Max50. The update improved various unit features while simultaneously reducing overall cost. These 19-inch plug-in power supply units feature an output of 50 W and voltages of 5, 12, 15, 24 or 48 V and are used in a wide variety of industrial applications.

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August 21, 2017

nVent Introduces New High Thermal Performance Retainer Series

nVent announces the release of a new Schroff retainer design, the Calmark High Thermal “HT” Card Lok.
The 280HT Card Lok increases thermal performance by up to 15 percent over similarly sized Card Loks.
Printed circuit boards are getting more powerful and as a result thermal management has become more difficult. The 280HT Card Lok provides best-in-class thermal performance versus cost, especially when compared to other more complex methods like liquid cooling or re-designing existing systems.

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July 10, 2017

nVent Expands Range of Schroff brand of CalmarkTM High Clamp Force, Small Profile Card Loks

nVent announces its newly designed Schroff brand of Calmark™ Series 263HC, 265HC, and 276HC High Clamp Force Card Lok retainers. The patent-pending High Clamp “HC” force design provides an average of three times the clamping force of similarly sized Card Loks.

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June 5, 2017

Products and solutions for the entire network - More performance for network function virtualization

As one of the market and technology leaders for systems and electronics protection solutions, nVent is actively working on the definition, specification and introduction of new technologies. nVent has been heavily involved in the specification and implementation of AdvancedTCA, the standard for high-performance communications blade servers. The same thing is now happening with the next generation of follow-up technology, 5G network infrastructure.

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May 22, 2017


nVent, a global leader in protecting critical processes, people and the environment, has developed a complete Schroff Embedded COM system including the COM module and the carrier board. This concept is also modular for greater design flexibility. For example, a wide range of fieldbus connections can be implemented using a pluggable add-on module. Using the XMC slot, FPGA mezzanines or processor modules can be connected to the COM module via the carrier or a custom circuit can be established on the prototype module.

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March 7, 2017


nVent, a leading manufacturer of embedded systems, is presenting the new Schroff ServCite rack based on the highly efficient OCP (Open Compute Project) concept at the OCP U.S. Summit 2017 in Santa Clara, Calif., on March 8 and 9. The ServCite rack has been developed specifically to meet the stringent requirements of the telecommunications industry for shock and vibration resistance, high availability and reliable cooling capacity. Compared to other products typically used in the telecommunications industry such as AdvancedTCA, the Schroff ServCite rack has significantly higher data processing and/or storage density. The Schroff ServCite rack is developed in accordance with the new CG-OpenRack-19 specification.

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Featured Tradeshows

September 18 - 21, 2018

InnoTrans 2018

Berlin, Germany

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November 13 - 16, 2018

Electronica 2018

Munich, Germany

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