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Embedded Systems

Embedded COM Systems: Modular, Powerful, Versatile

COM Express modules, standardized by PICMG, support the latest signals such as HDMI, Gigabit Ethernet, USB 2.0 & 3.0 and PCI Express.  This versatility makes COM Express ideal for lab and field use.

nVent SCHROFF offers solutions based on a modular COM (Computer On Module) carrier for type 6 COM express modules.  The system includes an innovative case with cooling and power management, the COM carrier and the COM module.  Many customizations are possible:

  • Interfaces can be adjusted based on requirements
  • Slots for various expansion boards
  • Efficient, low-interference power supply
  • Choice of integration level
  • Ingress protection is possible from IP 55 to IP 67
  • Flexible cooling design for forced air cooling or passive cooling applications
  • The height, width and depth of the small case can be adjusted

The innovative case features integrated cooling, power management and EMC protection.

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Specific heat sink geometries for different applications
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Thermal connection from COM heat spreader to heat sink with EMC gaskets on thermal adapter
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Easy removal of front and rear panel

Com Carrier

A COM carrier is a carrier board to which a COM module is plugged. The use of COM modules reduces development costs and saves time.

All I/O interfaces are provided on the nVent SCHROFF carrier board. For new product development, this means standardized COM modules from different manufacturers can be used along with either the standard or a customized COM carrier from nVent SCHROFF.

Additionally, the nVent SCHROFF COM Carrier provides common computer interfaces and features slots for various expansion boards. Expansion boards are inserted parallel to the carrier and include additional features such as a MiniPCI Express interfaces for connecting graphics cards, hard drives or wireless modules. Other expansion boards include a postcode module for debugging hardware and software, a prototype module for integrating additional functions using the GPIOs of the COM module or fieldbus modules for connecting to industry fieldbuses. Additionally, nVent provides an interface for a PMC or an XMC module using these kinds of expansion boards.

 

Front side: Standard computing interfaces
Front side: Standard computing interfaces

Back side: Additional computing interfaces
Back side: Additional computing interfaces

Helpful Resources

Datasheet

COM Carrier Boards for COM Express type 6 Modules

Datasheet

COM Nano: Modular Industrial PC with an Integrated COM

Whitepaper

Essential guide to select an integrated COM Express system

Datasheet

COM Carrier System: Project Timeline