EDGE TO THE CLOUD, GREATER EFFICIENCY and LOWER COST OF OWNERSHIP
Maintaining high availability (uptime) at minimal operational costs remains a major challenge in today’s data centers and networks where a significant portion costs are dedicated to energy consumption for IT equipment and server cooling.
nVent SCHROFF offers a comprehensive range of standard and customized air, indirect and direct water cooling solutions. Our product range enables you to meet these challenges and protect your IT assets, whether for smaller decentralized edge computing, harsh environments, or large data center installations.
Direct Liquid Cooling / CDUs
Coolant Distribution Units and manifolds for high density, direct-to-chip liquid and hybrid cooling up to 100 kW per Rack
DIRECT-TO-CHIP LIQUID COOLING
- High density liquid cooling at processor level
- Rack-mount or row-based liquid-to-liquid Cooling Distribution Units
- Rack manifolds to manage liquid distribution between CDU and cold plate loops suitable for various server or rack environments
HYBRID HIGH DENSITY PRECISION COOLING
- Enable 100% utilization of rack and data center spaces at high densities
- Facilitate peak performance for processors
- Dependence on fans and expensive air handling systems is drastically reduced
- Reduce chilled water requirements and OPEX with warm water cooling
RDHX Pro
Rear Door Heat Exchanger - kW 78
Revolutionary new RDHX PRO by nVent meets needs for vastly increased data processing power to meet the requirements of AI-enhanced software applications
RDHX PRO provides scalable, pay-as-you-go, room-neutral solution for cooling high-density racks up to 78 kW
New rear door heat exchangers provide highly resilient operations, with hot-swappable, tool-less replacement of critical components, including fans and PSUs.
BENEFITS
- Maximum availability and quick repair
- Designed for efficient operation at increased facility water
temperatures - Combination with direct-to-chip liquid cooling
- Modular standard easy to adapt to individual requirements
- Minimal planning outlay/short setup time
- No need to open the door while servicing fans screws cannot be dropped or lost on the data center floor as they are attached to the module.
Rear Door Cooling
Rear door air-to-liquid heat exchanger for high performance computing, up to 55 kW/ rack
RACKCHILLER REAR DOOR
Cools the warm exhaust air in the existing rack-mounted IT equipment through a large cooling coil surface before re-introducing to the room.
Completely passive or active with additional fan package
Advanced control and sensor options (differential pressure, flow, temp.)
BENEFITS
- Passive solution: no noise, no power consumption, low maintenance
- Active solution: fans support the air flow and minimize pressure drop of the heat exchanger supporting heterogeneous rack-mount equipment
- Frame solution allows separation of coil and condensate management from the rack-mount equipment and rear space inside the cabinet is completely available for cabling and power distribution
- Available in 6 different standard dimensions
LHX 45 +
IN-ROW COOLING
In-Row cooling unit is the industry's first-row cooling device with tool-less hot-swappable fans, PSU, and controller in one unit. This ensures that your data center experiences no temperature spikes. The device's innovative tool-less features allow maximum uptime and minimal service callouts, resulting in year-round savings.
BENEFITS
- Ideal for edge computing and physics applications
- Maximum availability and quick repair
- Designed for efficient operation at increased
facility water temperatures - Combination with direct to chip liquid cooling
- Modular standard - easy to adapt to
individual requirements - Minimal planning outlay / short setup time
- Minimum changes between In-Row and LHX (In-Rack) design - simplifies planning, layout and specification.
- Smart Precision Cooling for edge applications
In-Row 45
IN-ROW COOLING
In-Row cooling unit is the industry's first-row cooling device with tool-less hot-swappable fans, PSU, and controller in one unit. This ensures that your data center experiences no temperature spikes. The device's innovative tool-less features allow maximum uptime and minimal service callouts, resulting in year-round savings.
BENEFITS
- Ideal for hot Aisle Containment.
- Maximum availability and quick repair.
- Designed for efficient operation at increased
facility water temperatures. - Combination with direct to chip liquid cooling.
- Modular standard - easy to adapt to
individual requirements. - Minimal planning outlay / short setup time.
- Minimum changes between In-Row and LHX (In-Rack) design - simplifies planning, layout and specification.